MiniFAB uses semi-conductor processes to make MEMS type devices on silicon substrates. Surface micromachining and bulk micromachining processes can be used to produce micro-features in silicon, photoresists or thin metal films. Clients can use our MEMS capability to test their proof-of-principle device designs and complete low volume production runs. This capability can also be used in combination with our electroforming and thin film deposition capability to produce MEMS type devices.

• Lithography suite

  • MiniFAB can fabricate MEMS type micro-features as small as 2 µm in width using its UV-lithography capability in both positive and negative photoresist. For micro-features smaller than 1 µm MiniFAB offers its nano-imprint lithography service. We also have experience in conventional semi-conductor processes such as lift-off and wafer bonding.
• Photoresists

  • MiniFAB has experience with a wide range of photoresists such as AZ series, SU-8, BPR series, specialized lift-off resists and dry film resists.
• Active sensors (powered)

  • Electrodes, electrode pads, and interdigitated fingers are standard features for micro-electronic sensors. MiniFAB can manufacture metal features with widths as small as 1µm. Materials (including a combination of materials) and feature sizes that may be challenging for conventional PCB fabrication methods can be routinely processed at MiniFAB. Typical substrates handled include polymers, silicon and piezoelectric materials (eg. LiNbO4, LiTaO4, PZT).
• Passive sensors (non-powered)

  • MiniFAB has integrated various optical, fluidic and mechanical micro-structures to create devices that can be interrogated by external instrumentation.
• Sensor packaging

  • As an alternative to off-the-shelf boxes, MiniFAB offers custom housing of micro-sensors to protect from damage during transport and the environment during operation. Some typical packages used are moulded polymer cases, epoxy, polyurethanes, or rapid prototyped materials.
• Electrical packaging

  • The integration of small electronic components into active devices requires specialized tooling and processes that are not readily available through conventional electronic manufacturers. MiniFAB offers solutions to these more challenging electrical interconnect problems that require wire bonding, die bonding of single to high density boards. Encapsulation is often required after assembly for transport and testing and this can be included in the service to meet your requirements. Our service will enable you to create one-off prototypes and small volume production runs.