MiniFAB has developed significant expertise in polymer-based platforms for the fabrication of micro devices. We specialize in the integration of functional components (eg. electrodes, sensors) onto these platforms and the modification of surfaces for biological and environmental protection. All the processes used by MiniFAB incorporate some of the materials named here. We are always keen to explore new and novel materials that may suit your application.

• Polymers

  • Polymers used are selected from an extensive list of polymer materials based on user requirements. They can offer a versatile and low cost solution to many applications. Polymers used routinely by MiniFAB include PC, PMMA, ABS, PVC, PET, COC, PI, PEEK, PS, etc.
• Thin films

  • Thin films allow localized functionality or surface modification to be added to devices. Thin film deposition by magnetron sputtering includes metals such as Al, Cu, Au, Cr, Ti, Ni, W. Other metal materials may be available on request.
• Parylene

  • Conformal polymer coatings using C-type and N-type parylene are available for biocompatible coatings, improved chemical resistance and environmental protection.
• Semi-conductor

  • 4" silicon wafers are our processing standard for MEMS applications. Photoresist options include SU-8, AZ series and BPR series. Laminar based dry film resists are also available.
• Thick films

  • Electroformed films in nickel or copper are routinely deposited. Alloy deposition and other metals are available on request.
• Hybrid solutions

  • Combinations of polymer, metal, ceramics and composites can be processed by MiniFAB. Solutions are handled on a case-by-case basis, based on user requirements.